Thin Wafer Solutions
System Offerings for Delicate Highly Thinned / Highly Warped Wafers
FLEX300
eWLB Solutions
150mm / 200mm Thin Wafer
Packaging complexity is ever increasing. NADAtech is on forefront with several system offerings for your very delicate highly thinned / highly warped wafers.
FLEX 300 for Maximum Compatibility
Designed for MAXIMUM wafer type compatibility, this system utilizes highest reliability robotics, ports, aligners, OCR and QR readers for use in simplifying BEOL complexity.
- 200mm bridge or 300mm systems available
- 3 to 5 port configuration
- Paddle changer design to support wafers types from ultra-thin to ultra-thick
- Standard with flip
- Bernoulli type
- Needles type for taiko ring
- eWLB type
- Highly integrated wafer alignment technologies with Notchless / Foil notch / Standard notch aligner modes / Oversized carrier wafers
- Top and bottom OCR / QR / BCD
- Support addition of ANY NADAtech Sorter+ modules
- Other additions include microscopes and high end edge inspection devices
eWLB Solutions for Warped Wafers
To accommodate unique needs of eWLB wafers, NADAtech has created a special series of robot end-effectors and wafer alignment technologies to solve problems associated with highly warped yet rigid eWLB wafer.
- Specialized eWLB paddles for 150mm / 200mm / 300mm
- Unique aligner strategies to overcome warped wafer alignment problems
- Automated 13 / 25 slot open carrier detection
150mm / 200mm Thin Wafer Solutions
For unique needs of small diameter highly thinned wafers, NADAtech has a line of robot end-effectors and wafer alignment technologies to accommodate handling delicate thin wafers.
- Specialized thinned wafer paddles for 150mm / 200mm including Bernoulli
- Unique aligner technologies to overcome thin wafer alignment problems
- Automated 13 / 25 slot open carrier detection
