Thin Wafer Solutions

System Offerings for Delicate Highly Thinned / Highly Warped Wafers

Flex300 thin wafer solutions

FLEX300

eWLB thin wafer solutions

eWLB Solutions

150-200mm thin wafer solutions

150mm / 200mm Thin Wafer


Packaging complexity is ever increasing. NADAtech is on forefront with several system offerings for your very delicate highly thinned / highly warped wafers.

FLEX 300



Designed for MAXIMUM wafer type compatibility, this system utilizes highest reliability robotics, ports, aligners, OCR and QR readers for use in simplifying BEOL complexity.

  • 200mm bridge or 300mm systems available
  • 3 to 5 port configuration
  • Paddle changer design to support wafers types from ultra-thin to ultra-thick
    • Standard with flip
    • Bernoulli type
    • Needles type for taiko ring
    • eWLB type
  • Highly integrated wafer alignment technologies with Notchless / Foil notch / Standard notch aligner modes / Oversized carrier wafers
  • Top and bottom OCR / QR / BCD
  • Support addition of ANY NADAtech Sorter+ modules
  • Other additions include microscopes and high end edge inspection devices

eWLB Solutions



To accommodate unique needs of eWLB wafers, NADAtech has created a special series of robot end-effectors and wafer alignment technologies to solve problems associated with highly warped yet rigid eWLB wafer.

  • Specialized eWLB paddles for 150mm / 200mm / 300mm
  • Unique aligner strategies to overcome warped wafer alignment problems
  • Automated 13 / 25 slot open carrier detection

150mm / 200mm Thin Wafer



For unique needs of small diameter highly thinned wafers, NADAtech has a line of robot end-effectors and wafer alignment technologies to accommodate handling thin and delicate wafers.

  • Specialized thinned wafer paddles for 150mm / 200mm including Bernoulli
  • Unique aligner technologies to overcome thin wafer alignment problems
  • Automated 13 / 25 slot open carrier detection