MEMS Bond Room Solutions

NADAtech has developed award-winning inspection and metrology solutions for bonded wafers, with many innovations evolving into game changing technologies for our clients.

IR inspections are used to catch bonder problems before they become costly repeaters. IRIx is used after wafer bond to detect any internal bonding related cracks or voids on frit type, metal to metal eutectic, and silicon to silicon bonding. It is also used post saw to inspect for un-removed saw lanes.

• 2 and 3 station 150mm / 200mm MEMS 1X IR inspection
• HiDef 16bit InGaAs IR Camera
• Reflective / transmissive IR illumination stations
• Fully integrated and customizable defect detection software
• Standard ASCII, K L A R F or GEMSECS reporting
• Raw masked subtracted and processed images exporting available
• Optional bright field module for void detection
• Optional OCR
• Optional flip for metal backed wafers

IR20x metrology steps are used post bond for measuring internal wafer bond features. Measuring bonding seal width and measure cap to CMOS wafer overlay are typical measurements.

• IR20x is a modular option available any IR capable tool
• HiDef 16bit InGaAs IR Camera
• Reflective / transmissive IR illumination station
• 10 to 20x IR optical column
• No staging required / wafers positioned with robot for rapid measuring
• Fully integrated and customizable measurement software
• Standard ASCII, K L A R F or GEMSECS reporting
• Raw and processed image exporting available

Dry and chemical-less technology used for cleaning MEMS devices post-release / pre-bond.

• Stand alone 2 station MEMS wafer cleaner
• Technology alleviates Van der Waals like forces which keep particles adhered to the wafer
• More effective than operator removing manually

Unique process tools for separating saw lanes from sealed device wafer. Includes inspection module to ensure 100% removal.

• Post saw MEMS cap wafer release system
• AOI inspection and manual rework station