Sorter+ Options
Add Dual and Triple Functionality to Standard Systems
Bright Light Inspection
Wafer Flip
Wafer Edge Inspection
Extend the functionality of your system with NADAtech’s Sorter+ Inspection and Metrology Options. Find and measure defects on wafer surfaces and edges using a variety of specially designed applications without adding extra equipment to your production floor.
Select the Sorter+ Options that Best Meet Your Specific Needs:
Bright Light Inspection
+Gyro
- Front and backside bright light inspection
- Optional full rotation
- 150mm / 200mm / 300mm
- Wafer top-side and bottom-side visual inspection
- Joystick control or programmable recipe control with pass/fail button
- Function can be added to any typical sorting recipe
Bright Light Inspection
+EdgeGyro
- Edge handling only
- Typical bright light inspection for substrate manufacturers
- Front and backside bright light inspection
- Full infinite rotation
- 150mm / 200mm / 300mm
- Wafer top-side and bottom-side visual inspection
- Joystick control or programmable recipe control with pass/fail button
- Function can be added to any typical sorting recipe
Bright Light Inspection
+Gimbal
- Front side only bright light inspection
- Full gimbaling action for topside visual inspection
- Joystick control or programmable recipe control with pass/fail button
- Function can be added to any typical sorting recipe
EBR Measurement
+EBR
- Measured on aligner
- Programmable points
- Verify EBR mask alignment
End Effector QC
+EEQC
- Check paddle tolerances against known standard at teach time
- SPC data generation for alarm and limits monitoring
- Runs prior to recipe start
- Perfect for last tool to touch wafer applications
Automated Optical Inspection (AOI)
+MIDS
- Our newest Sorter+ Option, designed to meet industry demand
- Module created to help with common visible macro defects
- Add INLINE inspection to your wafer sort
- NO GOLDEN IMAGES
- Adds ~4 to 5 seconds per wafer
- Completely integrated operation and reporting
- Standard ASCII and SECS / GEM reporting with defect size and location
- Broad spectrum OMNI color LED lighting + grazing dark field LED
- Dome reflector used for omni-directional illumination
- 15mpixel color CMOS imaging camera and coaxial light port
- Additional lighting options - combo dark field / bright field
- Excellent for 3D type defects such as EPI “volcanoes”
- Image stack post processing shows “repeaters” and defect clustering
P/N Type Detector
+PN Type
- Used to determine P-Type or N-Type wafer doping for silicon manufacturers
- Detection occurs in parallel with wafer alignment
- P-Type or N-Type is reported with WaferID in SECS/GEM report
Quartz Loader
+VL
- Vertical loading quartz boat loader with OCR wafer sort
- Perfect for mix and match quartz boat loading / unloading
- Concurrent 150mm / 200mm wafer sizes
- ISEL robotics
Scribe Location Inspection
+SLI
- Option for any system using OCR
- Measures scribe location against a qualified location
- Automated characterization
- Automated inspection
- Function can be added to any typical sorting recipe
- Includes SECS / GEM reporting for X / Y and linear offests
- Limits monitoring and alarms
Wafer Edge Inspection
+ChipChecker
- One of our first Sorter+ Options
- Top and bottom bevel inspection option
- Function can be added to any typical sort recipe
- Scans wafer bevel for cracks and chips after Align / OCR function
- Standard ASCII and SECS / GEM reporting with defect size and location
- Optional image capture and industry standard XY Report Formating
- Captures defects down to 0.5mm, with latest generation seeing defects down to 60um
- Version 1.0 flags failed wafers and shows number of chips >0.3mm defect bare wafer / >0.5mm defect processed
- Version 2.0 easily detects bonding edge problems and captures multi-tiff images of each chip for K L A R F, recording chip location and size
Wafer Flip
+Flip
- Flip option for wafer flip applications
- 180 degree for standard wafer flip
- Bonded wafer / MEMS applications
- Single paddle / dual paddle
- Single flip / dual flip
Wafer Flip
+FlipStation
- Flip option for difficult wafer applications
- Stand alone station for 180 degree flip
- Bonded thin wafer / warped wafer / MEMS applications
Wafer Slip Detection
+SlipFinder
- Wafer slip is detected and measured using propriety Hologenix lighting and software
- Recipes can scan outer wafer edge, center of wafer, both or entire wafer
- 150mm / 200mm / 300mm
- Typical for EPI and SOI mis-process slip detection
- Completely integrated operation and reporting
Wafer Surface Inspection
+Dimple
- Surface defects are detected and measured using fully integrated Hologenix optics
- Uses defocused optics for finding surface defects ( dimples or mounds )
- Typical for wafer polishing defects
- Perfect for finding Post CMP over and under polished areas
- Also used for Post wafer bond MEMS defect inspection
- 150mm / 200mm / 300mm versions
- Whole wafer image processing or magnified version are available
- Optional stocker and agv integrated e84 delivery
Wafer Thickness Measurement
+Thickness
- Average thickness/ttv/bow/warp
- 150mm/200mm/300mm
- Single center point or radial profiling
- Confocal laser or white light interferometer depending on application
- White light interferometer with 0.3 um repeatability
- On robot approach for high throughput
- Function can be added to any typical sorting recipe
- Typical recipes bin wafer based on thickness
