Sorter+ Options

Add Dual and Triple Functionality to Standard Systems

Sorter+ Bright Light Inspection

Bright Light Inspection

Sorter+ Edge Inspection

Edge Inspection

Sorter+ Dimple Inspection

Surface Inspection


Extend the functionality of your system with NADAtech’s Sorter+ Inspection and Metrology Options. Find and measure defects on wafer surfaces and edges using a variety of specially designed applications without adding extra equipment to your production floor. Choose from the following Sorter+ Options:

Bright Light Inspection


+Gyro

bright light inspection
  • Front and backside bright light inspection
  • Optional full rotation
  • 150mm / 200mm / 300mm
  • Wafer top-side and bottom-side visual inspection
  • Joystick control or programmable recipe control with pass/fail button
  • Function can be added to any typical sorting recipe

Bright Light Inspection


+EdgeGyro

bright light inspection
  • Edge handling only
  • Typical bright light inspection for substrate manufacturers
  • Front and backside bright light inspection
  • Full infinite rotation
  • 150mm / 200mm / 300mm
  • Wafer top-side and bottom-side visual inspection
  • Joystick control or programmable recipe control with pass/fail button
  • Function can be added to any typical sorting recipe

Bright Light Inspection


+Gimbal

front side bright light inspection
  • Front side only bright light inspection
  • Full gimbaling action for topside visual inspection
  • Joystick control or programmable recipe control with pass/fail button
  • Function can be added to any typical sorting recipe

EBR Measurement


+EBR

ebr measurement
  • Measured on aligner
  • Programmable points
  • Verify EBR mask alignment

End Effector QC


+EEQC

  • Check paddle tolerances against known standard at teach time
  • SPC data generation for alarm and limits monitoring
  • Runs prior to recipe start
  • Perfect for last tool to touch wafer applications

Macro Inspection During Sort


+MIDS

Macro Inspection During Sort
  • Module created to help with common visible macro defects
  • Add INLINE inspection to your wafer sort
  • NO GOLDEN IMAGES
  • Adds ~4 to 5 seconds per wafer
  • Completely integrated operation and reporting
  • Standard ASCII and SECS / GEM reporting with defect size and location
  • Broad spectrum OMNI color LED lighting + grazing dark field LED
  • Dome reflector used for omni-directional illumination
  • 15mpixel color CMOS imaging camera and coaxial light port
  • Additional lighting options – combo dark field / bright field
  • Excellent for 3D type defects such as EPI “volcanoes”
  • Image stack post processing shows “repeaters” and defect clustering

P/N Type Detector


+PN Type

Sorter+ PN Type
  • Used to determine P-Type or N-Type wafer doping for silicon manufacturers
  • Detection occurs in parallel with wafer alignment
  • P-Type or N-Type is reported with WaferID in SECS/GEM report

Quartz Loader


+VL

quartz loader
  • Vertical loading quartz boat loader with OCR wafer sort
  • Perfect for mix and match quartz boat loading / unloading
  • Concurrent 150mm / 200mm wafer sizes
  • ISEL robotics

Scribe Location Inspection


+SLI

scribe location inspection
  • Option for any system using OCR
  • Measures scribe location against a qualified location
  • Automated characterization
  • Automated inspection
  • Function can be added to any typical sorting recipe
  • Includes SECS / GEM reporting for X / Y and linear offests
  • Limits monitoring and alarms

Wafer Edge Inspection


+ChipChecker

wafer edge inspection
  • Top and bottom bevel inspection option
  • Function can be added to any typical sort recipe
  • Scans wafer bevel for cracks and chips after Align / OCR function
  • Standard ASCII and SECS / GEM reporting with defect size and location
  • Optional image capture and industry standard XY Report Formating
  • Captures defects down to 0.5mm, with latest generation seeing defects down to 60um
  • Version 1.0 flags failed wafers and shows number of chips >0.3mm defect bare wafer /  >0.5mm defect processed
  • Version 2.0 easily detects bonding edge problems and captures multi-tiff images of each chip for K L A R F, recording chip location and size

Wafer Flip


+Flip

wafer flip
  • Flip option for wafer flip applications
  • 180 degree for standard wafer flip
  • Bonded wafer / MEMS applications
  • Single paddle / dual paddle
  • Single flip / dual flip

Wafer Flip


+FlipStation

wafer flip station
  • Flip option for difficult wafer applications
  • Stand alone station for 180 degree flip
  • Bonded thin wafer / warped wafer / MEMS applications

Wafer Slip Detection


+SlipFinder

wafer slip detection
  • Wafer slip is detected and measured using propriety Hologenix lighting and software
  • Recipes can scan outer wafer edge, center of wafer, both or entire wafer
  • 150mm / 200mm / 300mm
  • Typical for EPI and SOI mis-process slip detection
  • Completely integrated operation and reporting

Wafer Surface Inspection


+Dimple

wafer surface inspection
  • Surface defects are detected and measured using fully integrated Hologenix optics
  • Uses defocused optics for finding surface defects ( dimples or mounds )
  • Typical for wafer polishing defects
  • Perfect for finding Post CMP over and under polished areas
  • Also used for Post wafer bond MEMS defect inspection
  • 150mm / 200mm / 300mm versions
  • Whole wafer image processing or magnified version are available
  • Optional stocker and agv integrated e84 delivery

Wafer Thickness Measurement


+Thickness

wafer thickness measurement
  • Average thickness/ttv/bow/warp
  • 150mm/200mm/300mm
  • Single center point or radial profiling
  • Confocal laser or white light interferometer depending on application
  • White light interferometer with 0.3 um repeatability
  • On robot approach for high throughput
  • Function can be added to any typical sorting recipe
  • Typical recipes bin wafer based on thickness