inspection and metrology options for wafer sorters

Takes sorter automation one step further by adding inspection and metrology components.

NADAtech Sorter+ features include:

  • wafer bevel inspection,
  • wafer flip,
  • bright light front side inspection,
  • bright light backside inspection,
  • wafer thickness measurement,
  • 1x Visible Macro defect inspection,
  • 1x IR Macro Defect inspection for bonded wafers,
  • 20x IR metrology for bonded wafers,
  • slip detection,
  • dimple detection,
  • p-type / n-type
  • scribe location inspection