IRIx MEMS wafer inspection

IR inspections are used to catch bonder problems before they become costly repeaters.

IRIx is used after wafer bond to detect any internal bonding related cracks or voids.

used on frit type / metal to metal eutectic / silicon to silicon bonding

Also used post saw to inspect for un-removed saw lanes.

  • 2 and 3 station 150mm/200mm MEMS 1X IR inspection
  • HiDef 16bit InGaAs IR Camera
  • reflective / transmissive IR illumination stations
  • fully integrated and customizable defect detection software
  • standard ascii / gemsecs / standard industry reporting format
  • raw masked subtracted and processed images exporting available
  • optional dimple module
  • optional OCR
  • optional flip for metal backed wafers