IR20x MEMS Metrology

IR20x MEMS metrology

IR20x metrology steps are used post bond for measuring internal wafer bond features. Measuring bonding seal width and measure cap to cmos wafer overlay are typical measurements.

  • ir20x is a modular option available any IR capable tool
  • HiDef 16bit InGaAs IR Camera
  • reflective / transmissive IR illumination station
  • 10 to 20x IR optical column
  • no staging required / wafers positioned with robot for rapid measuring
  • fully integrated and customizable measurement software
  • standard ascii / gemsecs / standard industry reporting format
  • raw and processed image exporting available