Edge and Surface Inspection Solutions

Extend the functionality of your system with NADAtech’s Sorter+ Inspection and Metrology Options. Find and measure defects on wafer surfaces and edges using a variety of specially designed applications without adding extra equipment to your production floor. Choose from the following Sorter+ Options:

• Top and bottom bevel inspection option
• Function can be added to any typical sort recipe
• Scans wafer bevel for cracks and chips after Align / OCR function
• Standard ASCII and SECS / GEM reporting with defect size and location
• Optional image capture and industry standard XY Report Formating
• Captures defects down to 0.5mm, with latest generation seeing defects down to 60um
• Version 1.0 flags failed wafers and shows number of chips >0.3mm defect bare wafer /  >0.5mm defect processed
• Version 2.0 easily detects bonding edge problems and captures multi-tiff images of each chip for K L A R F, recording chip location and size

• Surface defects are detected and measured using fully integrated Hologenix optics
• Uses defocused optics for finding surface defects ( dimples or mounds )
• Typical for wafer polishing defects
• Perfect for finding Post CMP over and under polished areas
• Also used for Post wafer bond MEMS defect inspection
• 150mm / 200mm / 300mm versions
• Whole wafer image processing or magnified version are available
• Optional stocker and agv integrated e84 delivery

• Front and backside bright light inspection
• Optional full rotation
• 150mm / 200mm / 300mm
• Wafer top-side and bottom-side visual inspection
• Joystick control or programmable recipe control with pass/fail button
• Function can be added to any typical sorting recipe

• Edge handling only
• Typical bright light inspection for substrate manufacturers
• Front and backside bright light inspection
• Full infinite rotation
• 150mm / 200mm / 300mm
• Wafer top-side and bottom-side visual inspection
• Joystick control or programmable recipe control with pass/fail button
• Function can be added to any typical sorting recipe

• Front side only bright light inspection
• Full gimbaling action for topside visual inspection
• Joystick control or programmable recipe control with pass/fail button
• Function can be added to any typical sorting recipe

• Module created to help with common visible macro defects
• Add INLINE inspection to your wafer sort
• NO GOLDEN IMAGES
• Adds ~4 to 5 seconds per wafer
• Completely integrated operation and reporting
• Standard ASCII and SECS / GEM reporting with defect size and location
• Broad spectrum OMNI color LED lighting + grazing dark field LED
• Dome reflector used for omni-directional illumination
• 15mpixel color CMOS imaging camera and coaxial light port
• Additional lighting options - combo dark field / bright field
• Excellent for 3D type defects such as EPI “volcanoes”
• Image stack post processing shows “repeaters” and defect clustering

• Option for any system using OCR
• Measures scribe location against a qualified location
• Automated characterization
• Automated inspection
• Function can be added to any typical sorting recipe
• Includes SECS / GEM reporting for X / Y and linear offests
• Limits monitoring and alarms