Comprehensive Wafer Inspection + Metrology
Integrated for Real‑Time Wafer Quality
NADAtech Inspection and Metrology solutions are purpose-built for inline wafer inspection and precision process control across FEOL and advanced packaging environments. From automated optical inspection (AOI) to integrated metrology modules, our systems deliver real-time feedback to identify defects, ensure dimensional accuracy, and safeguard wafer integrity. Designed for seamless integration with wafer sorters, our modular architecture enables manufacturers to scale up capabilities as process demands evolve. Whether monitoring CMP results, tracking lithography overlay, or validating etch uniformity, NADAtech systems empower fabs to detect deviations early and reduce yield-impacting errors—without interrupting workflow. Elevate your process control with tools engineered to reduce cycle time and enhance yield through actionable, inline quality insights.
Bow Warp Measurement (+BowWarp)
The Bow Warp add-on module continues NADAtech’s trend of increased capabilities from a sorting platform. Utilizing an award-winning optical tomography sensor, our new module can measure total thickness variation, average thickness and bow/warp in scans that take seconds, not minutes. Add Bow Warp / Thickness to NADAtech’s ever growing list of bolt on Sorter+ options that give customers the competitive advantage they need.
- Non-contact bow / warp / thickness measurement
- Proprietary pre / post thin film stress measurement technique
- 3 seconds for standard 49pt scan BowWarp measurement
- FAST !! with proven 150wph throughput for 300mm wafer 49pt BW scan
- Scanning sensor - no wafer movement
- +/- 25μm XY sensor positioning
- Up to 70kHz data acquisition
- +/- 1μm with 0.36% Gage RnR repeatability
- GUI software for developing any type of scan shape required
- Measurements can be added to ANY wafer sort
- Sorter+ option for 150 / 200 / 300mm tools
- 2 / 3 / 4 port inline tool versions
- Available with other sorter+ options
Wafer Edge Inspection (+ChipChecker / +CC Pro)
Wafer edge chipping is a common problem in both wafer manufacturing and device fabs. The NADAtech ChipChecker product line provides the user with several options based on size of defects (area, height, width, depth), what part of wafer edge is required for inspection, inspection speed, and other critical variables. NADAtech works with our customers to determine the most cost effective solution.
- Scans wafer bevel for below and above surface defects including possible crack propagation
- +CC is a sensor based scanner that captures defect location and size down to 200um
- +CCpro is a shape based scanner that capture bevel data finding defects down to 10um in size
- Wafer edge scans are performed after wafer alignment and OCR functions
- Sensor options are based on particle/defect size requirements
- ASCII, industry standard defect report format and/or SECS/GEM communication
- Individual defect images and entire bevel images depending on sensor selection
- Wafer radial and flat inspection integration software that allows full wafer bevel imaging
- ChipChecker models available for all NADAtech sorter and stocker options
Automated Optical Inspection (+MIDS)
NADAtech's Macro Inspection During Sort (+MIDS) is for AOI wafer inspection. MIDS identifies wafer defects so the source can be quickly tracked down to keep problems from moving forward in your production line. The AOI module was created to single out wafers with common visible macro defects without the use of golden images. MIDS adds minimal time to standard sorting recipes.
- Add INLINE inspection to your wafer sort
- Golden Imaging Capable
- Adds ~4 to 5 seconds per wafer
- Completely integrated operation and reporting
- Standard ASCII and SECS / GEM reporting with defect size and location
- Brightfield LED and grazing darkfield LED illumination
- 25Mpixel color CMOS brightfield imaging camera
- 12Mpixel CMOS darkfield imaging camera
- Darkfield is excellent for 3D type defects such as EPI “volcanoes”. Proven down to 0.3um
- Brightfield used for both patterned and bare wafer inspection
Bright Light Inspection System (+BLIS)
The BLIS inspection module is a cost-effective means to provide users with the ability to visually inspect wafers during wafer sort. These systems allow the user to manipulate the wafer in 3D space to visually see the entire wafer either via a manually driven joystick or automatically controlled via system software.
- 90W UVP green light
- 12MP camera for image capture
- Joystick control and programmable recipe control with pass/fail button
- Function can be combined with any typical sorting recipe
- Full infinite rotation
- Optional blackout cabinet
Handling options: Inquire for smaller wafer sizes
- Edge grip handling for 200 and 300mm wafer sizes
- Edge grip allows for front and backside inspection
- 1 wafer size only
- Vacuum backside for 150-200mm
- Frontside inspection only
- Compatible with multiple wafer sizes
Edge Exclusion Measurement (+EEM)
The EEM subsystem is a simple yet very powerful means to automatically or manually measure modifications around the wafer edge exclusion zone. Whether measuring concentricity of a deposited film edge exclusion zone, or complete removal of the wafer edge bead, the EEM is a power enabler for providing accurate and fast metrology measurements.
- Removal of wafer edge photoresist buildup (post spin) or entire edge bead
- Wafer Edge Exclusion Profile Measurement
- Edge Modification Verification
- Typically customized to customer requirements
Edge Profile Measurement (+EPM)
The EPM is an optical metrology subsystem that automatically measures wafer bevel profiles. Supports standard profile shapes but includes capability to measure custom bevel shapes.
- 2 axis stage allows for bevel measurement at any wafer angle
- Typical bevels - Types A, B, C
- All material types
- 100mm, 150mm, 200mm, and 300mm
- Standard and High Resolution versions
- 25 second process time for 4 quadrant high resolution measurements
- Result images, GEM/SECS result events and CSV data files.
Wafer Center Thickness (+Thickness)
Wafer center thickness can be measured at NADAtech in many different ways. Perhaps one of the most economical means to measure wafer thickness is utilizing NADAtech’s differential white light sensors to provide singular or multiple thickness and/or total thickness variation measurements. These sensors are not only accurate, they are extremely repeatable.
- 150mm / 200mm / 300mm
- Single center point thickness or radial profiling for simple TTV
- Confocal laser or white light interferometer depending on application
- Proven 0.3% gage RnR at 100nm
- On robot approach for high throughput
- Function can be added to any typical sorting recipe
- Typical recipes bin wafer based on thickness
Infrared Inspection (+IRIx)
- Post-bond inspection for 100mm-300mm MEMS wafers
- Die Level Inspection of die edge, trench boundaries, and die corners
- Macro inspection reveals voids, delamination, and cracks
- Wide range of end-effector designs to meet MEMS handling requirements
- OCR & Wafer Flip are standard
Scribe Location Inspection (+SLI)
As the name scribe location inspection implies, these systems are setup as metrology inspection stations to verify several key global parameters during wafer laser scribe. These systems can measure global position, quality of the scribe (depth, widths), and general readability of the scribe.
- Option for any system using OCR
- Measures scribe location against a qualified location
- Automated characterization
- Automated inspection
- Function can be added to any typical sorting recipe
- Includes SECS / GEM reporting for X / Y and linear offests
- Limits monitoring and alarms
Air Knife Dry Wafer Cleaning (+RTAK / +LTAK)
- “Green” Wafer Cleaner - no chemicals, no liquids
- Ionized N2 (xCDA) blade cleaner on RT stage
- Programmable MFC for air knife gas flows
- Programmable Vacuum system to insure particles are removed
- Fully programmable scan rates and scan patterns
- Proven double digit yield increases for sensitive products
Atmospheric Plasma Cleaner (+APC)
Atmospheric plasma cleaning of wafers is a new concept in wafer cleans. This integrated function into wafer sorters and wafer stockers can be used as standalone APC cleaning or used in conjunction with our Airknife ionized cleaning blade technology. Use of APC results in cleaner wafers, with neutral surface charges, and also provides a super-hydrophillic wafer surface condition conducive to a more successful wafer bond in wafer bonding applications.
- Typical RF forward power 500-580 Watts
- Converts surface chemistry in general to non-volatile products
- Organics – O2 to CO2, Ar removes O -+ radicals
- RF head 2-4mm from wafer surface
- Neutralizes wafer surface charges
- Large reduction in surface water angle
- Si – <6 seconds to clean 200mm wafer
Wafer Flip (+Flip / +FlipStation)
Wafer Flip is common during wafer sort and even more readily used during wafer backside inspections. Many multi-axis robots can provide the function of wafer flip. Other applications which use gantry systems cannot provide the ability to flip wafers. In this case, a stationary wafer flip station can be implemented to provide the same function.
- +Flip option for wafer flip on robot
- Vacuum backside or active edge grip versions
- +FlipStation for stand alone flip station
- +FlipStation typically for more difficult wafer handling types and applications
End Effector Quality Control Checker (+EEQC)
The End Effector Quality Control Checker is a novel way to provide users with a fast and accurate verification that the wafer paddles are within normal operating parameters. Through beam sensors on a fixture within the system verify position and level of the paddles insuring over time that nothing mechanically has changed
- Check paddle tolerances against known standard at teach time
- SPC data generation for alarm and limits monitoring
- Runs prior to recipe start
- Perfect for last tool to touch wafer applications
Wafer Slip Detection (+SlipFinder)
Wafer slip is a phenomenon that can occur during the wafer manufacturing operations or in thermal steps during device manufacturing. Slip, another term for dislocations in the silicon lattice, is caused by plastic deformation of the crystalline lattices of the wafer material during high temperature processing. These slip lines can occur during EPI, diffusion, and annealing processes in the wafer fab.
- Wafer slip is detected and measured using proprietary lighting and software
- Recipes can scan outer wafer edge, center of wafer, both or entire wafer
- 150mm / 200mm / 300mm
- Typically used for EPI and SOI mis-process slip detection
- Completely integrated operation and reporting
- Individual wafer and lot summaries
Wafer Surface Inspection (+Dimple)
Dimples are usually defined as localized depressions or pits in the wafer surface. These can be circular dips typically 1-50 microns wide and a few microns deep. Depending on the inspection mode detecting dimples, they can show up as dark or bright spots. Dimples are usually always a result from improper wafer grinding (thinning) and/or CMP (chemical mechanical polish).
- Perfect for finding Post CMP over and under polished areas
- 150mm / 200mm / 300mm versions
- Whole wafer image processing or magnified version are available
- Optional stocker and agv integrated e84 delivery
- Surface defects are detected and measured using proprietary lighting and software
- Uses defocused optics for finding surface defects (dimples or mounds )
- Typical for wafer polishing defects
- Also used for Post wafer bond MEMS defect inspection
Percussive Wafer Tester (+PWT)
The Percussive test station is utilized largely at wafer manufacturing facilities to test wafers percussively using small padded pistons that lightly strike the wafers testing whether the wafer is structurally sound. Wafers that have endured edge chipping, crystalline structure dislocations, or other mechanical weakness will be filtered out of the wafer batches.
- High precision mechanical stylus
- Initiates force displacement responses
- Detects wafer fractures or other defects likely leading to wafer breakage
- Can be utilized to study crack propagation behavior
- Statistical data collection of wafer strength distributions
