Integrated Wafer Tools for Complex IDM Workflows
Engineered for Speed, Precision, and Process Control
Integrated Device Manufacturers (IDMs) demand both precision and repeatability from Front End of Line (FEOL) through Advanced Packaging operations. NADAtech supports IDMs with a full suite of wafer handling and inspection solutions—including Wafer Sorters, Wafer Stockers, EFEMs, and Inspection & Metrology tools—designed to integrate seamlessly across the entire production spectrum.
In FEOL environments, our tools enhance each pivotal step—from photolithography and etch to CMP—providing inline sorting and inspection that uphold process control, traceability, and yield integrity. Compatible with all carrier types (cassettes, SMIF pods, FOUPs), our systems ensure smooth operation across diverse fab segments.
In Advanced Packaging workflows, including Wafer-Level Packaging (WLP), our solutions meet the increasing demands of 2.5D/3D device fabrication. From wafer bonding and thinning to TSVs, RDL, and interposer assembly, we detect bow/warp, bonding voids, edge damage, and other defects in real time—protecting yield and addressing process excursions before they escalate.
With scalable configurations and proven reliability in global fabs, NADAtech's tools enable IDMs to optimize Overall Equipment Effectiveness (OEE), reduce scrap, and maximize yield—providing intelligent automation that adapts to both legacy and advanced process flows.
