The FLEX300, a Modular Automation Platform, is the First System to handle multiple thin wafer technologies.
NADA Technologies Inc. (NADAtech), an Austin-based automation solutions provider that develops and manufactures wafer and substrate automation for the semiconductor wafer and device industries, has shipped the first of multiple FLEX300 sorting systems.
The FLEX300 is NADAtech's newest modular concept sorting system for 300mm wafers. FLEX300 allows for additional modules such as automated bright light inspection, microscopes, 1x IR inspection, and wafer edge inspection modules and is built in a manner to be compatible with future modules. FLEX300 uses end-effector changing technology to facilitate handling a wide range of wafer types, thicknesses and wafer to paddle routes. The system also includes new technologies for aligning and reading QR code notch-less carrier wafers. The platform is NADAtech's first delivery utilizing full GEM300 standards compliance.
“The FLEX300 allows our customers to handle a previously unreasonable range of wafer types with a single solution,” said Tim Ewald, CEO of NADAtech. “We designed it for maximum flexibility. A next generation thinning process no longer means a new wafer handling solution. The FLEX300 is designed to handle it.”
NADAtech was founded on the principal that service is not a technology it is a commitment. With the launch of the FLEX300, the company again proves that they create the best solutions for their customer’s needs.