FLEX300

FLEX300

  • designed for MAXIMUM wafer type compatibility
  • 200mm bridge or 300mm 3 to 5 port configuration
  • system utilizes highest reliability robotics, ports, aligners and OCR and QR readers
  • paddle changer design to support wafers types from ultra thin to ultra thick
    • standard with flip
    • bernoulli type
    • needles type for taiko ring
    • eWLB type
  • internal wafer itineraries can be dynamically mapped to ANY paddle type per move
  • highly integrated wafer alignment technologies with
    • notchless / foil notch / standard notch aligner modes / oversized carrier wafers
  • top and bottom OCR / QR / BCD
  • support addition of ANY NADAtech sorter+ modules
  • other additions include microscopes and high end edge inspection devices
  • GEM300 compliant
flex300 + Scope